Polyimide Application Areas
Polyimide Application Areas – Polyimide Films Coating System – Cheersonic
Polyimide (PI) is a type of aromatic heterocyclic polymer compound containing an imide ring (-CO-N-CO-) on the main chain. It is one of the most heat-resistant varieties of engineering plastics at present and is widely used in aviation, aerospace, microelectronics, nano, liquid crystal, laser and other fields.
Downstream application areas of polyimide
Due to the good high and low temperature resistance, environmental stability, mechanical properties and excellent dielectric properties of PI film, it is widely used in many basic industries and high-tech fields.
- Flexible circuit board: The copper foil substrate (FCCL) of flexible circuit board and the protective layer of flexible circuit board (FPCB) are the most commonly used, and the market is also the largest.
- Insulating materials: insulation of motor and electronic equipment, high temperature resistant wires and cables, electromagnetic wires, high temperature resistant wires, insulating composite materials, etc.
- Electronic industry: printed circuit board motherboards, mobile phones, mobile phones, lithium batteries and other products. Generally speaking, PI films below 25m are commonly used.
- Applications in the semiconductor field: passivation layer and buffer inner coating of microelectronics, dielectric materials between multilayer metal layers, and important substrates for optoelectronic printed circuit boards.
- Amorphous silicon solar cell field: transparent PI film can be used as a soft solar cell base plate. Ultra-thin PI film can be used in solar sails (light sails).
Ultrasonic spraying systems have been proven to be used in various applications that require uniform and repeatable photoresist or polyimide film coatings. The thickness control range is from submicron to more than 100 microns, and any shape or size can be coated.
Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.
The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition volume. Low-speed spray shaping defines atomized spray as a precise and controllable pattern to avoid excessive spray when producing a very thin and uniform layer. The ultrasonic spray system can control the thickness from sub-micron to more than 100 microns, and can coat any shape or size.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
Chinese Website: Cheersonic Provides Professional Coating Solutions
