Polyimide Coating

Polyimide Coating – Photoresist & Polyimide Films Coating System – Cheersonic

Polyimide (PI) is an aromatic heterocyclic polymer compound with an imide chain link in its molecular structure. It is one of the most heat-resistant engineering plastics and is widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystal, laser and other fields.

Recently, all countries have listed the research, development and utilization of PI as one of the development priorities of new chemical materials in the 21st century. Polyimide, due to its outstanding characteristics in performance and synthesis, has great application prospects whether as a structural material or as a functional material. Polyimide is known as the top material of the polymer material pyramid, and is also known as a “problem solver”. Some industry insiders even believe that “without polyimide, there would be no microelectronics technology today.”

One of the earliest applications of polyimide is to prepare coatings. This type of substance is mainly used as enameled wire insulation coatings in coatings. Enameled wire insulation coatings are mainly dip-coated on the outer layer of various types of bare copper wires, alloy wires and glass fiber covered wires of round wires, flat wires, etc., to improve and stabilize the outer layer of the enameled wire.

The characteristics of insulating materials that meet the requirements of industrial technology development are that the insulation system should be able to work for a long time at 180-200℃ or even higher temperatures without significant weight loss and electrical strength reduction, and maintain good elasticity, moisture resistance, ozone resistance, arc resistance and other properties. Polyimide materials can well meet this use requirement to prepare insulation coatings with heat resistance grades of F and above. Polyimide can be used as insulating paint for electromagnetic wires, or as high-temperature resistant coatings.

Ultrasonic spraying systems have been proven to be used in various applications that require uniform and repeatable photoresist or polyimide film coatings. The thickness control range is from submicron to more than 100 microns, and any shape or size can be coated.

Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.

The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition volume. Low-speed spray shaping defines atomized spray as a precise and controllable pattern to avoid excessive spray when producing a very thin and uniform layer. The ultrasonic spray system can control the thickness from sub-micron to more than 100 microns, and can coat any shape or size.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Chinese Website: Cheersonic Provides Professional Coating Solutions