Preparation of the Ceramic Dielectric Layer
Preparation of the Ceramic Dielectric Layer The ceramic dielectric layer is the supporting framework of the AMB copper-clad laminate (CCL). Its quality directly impacts the thermal conductivity, mechanical strength, and reliability of the circuit board. The preparation process requires strict control of raw material purity and process parameters. The main steps are as follows: Raw Material Selection and Pretreatment Ceramic Powders: – Alumina (Al₂O₃): Purity ≥99.5%, low cost, [...]

