coating equipment solutions - ultrasonic atomization

9 07, 2026

Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures

Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures - Cheersonic As the electronic circuit board industry rapidly upgrades towards finer wire diameters, higher density, finer hole diameters, and blind via filling, PCB copper plating, as a core process in circuit board manufacturing, directly determines the current transmission efficiency and lifespan of the product. Traditional DC electroplating processes are [...]

8 07, 2026

Polyimide Coating

Polyimide Spray Coating Systems Polyimide Coating Machine for Semiconductor Wafers Ultrasonic polyimide coating equipment applies premium polyimide thin films on semiconductor wafers before the cutting procedure. This coating equipment realizes outstanding coating uniformity, accurate thickness regulation and reliable bonding force for solvent-containing polymer coating materials widely adopted in semiconductor manufacturing. As a clean and high-efficiency replacement for spin coating equipment, the ultrasonic coating technique [...]

8 07, 2026

Ultrasonic Spray Photoresist Coating for MEMS Wafers

Ultrasonic Spray Photoresist Coating for MEMS Wafers Ultrasonic spray of photoresist for MEMS wafers and other substrates with varying topographiesFor over ten years, researchers have carried out direct photoresist spraying on MEMS wafers, silicon substrates and assorted three-dimensional microstructures. Extensive studies have validated the merits of this deposition technique when filling deeply etched, tall surface relief structures with photoresist. Compared with traditional spin coating methods, [...]

8 07, 2026

Application of Ultrasonic Spraying Technology in SOFC Fabrication

Application of Ultrasonic Spraying Technology in SOFC Fabrication Ultrasonic spraying technology, as a novel thin-film fabrication process, has demonstrated significant advantages in the fabrication of electrolyte and electrode layers in SOFCs, providing a new technical pathway for SOFC thin film preparation. This technology utilizes the atomization effect of ultrasound to transform the prepared slurry into tiny, uniform droplets. These droplets are then precisely delivered to the substrate surface [...]

8 07, 2026

Semiconductor Wafer Coating

Semiconductor Wafer Coating Wafer-Level Ultrasonic Coating for Semiconductors Ultrasonic wafer coating equipment serves as an alternative to traditional spin coating for semiconductor manufacturing, delivering superior thin-film consistency, accurate process regulation and far higher raw material utilization in photolithography workflows. Standard spin coating struggles with uneven coverage on wafers featuring steps, grooves and recessed cavities, resulting in inconsistent layering of photoresist and dielectric substances. Precision ultrasonic [...]

8 07, 2026

Sensor Coatings

Sensor Coatings Ultrasonic Thin Film Coating Solutions for Sensor Fabrication Ultrasonic spray equipment delivers premium thin film coatings on sensor components with functional nanoparticle blends, polymer materials, conductive polymer coating formulations and oxide compound mixtures. This contact-free coating technology generates even thin film layers on diverse sensor base materials, featuring highly regulated film thickness spanning nanoscale coatings up to dozens of microns. Real-time closed-loop monitoring [...]

8 07, 2026

Microelectronic Coating

Microelectronic Coating Ultrasonic coating equipment delivers high-precision thin layer deposition tailored to sophisticated microelectronic hardware and assorted electronic parts. The equipment handles a wide range of coating materials, ranging from photoresist thin layers and conductive polymer coatings to electromagnetic interference shielding layers and soldering flux films used in high-end packaging processes. These coating setups generate evenly distributed coating layers while boasting outstanding material utilization rate, [...]

8 07, 2026

Photoresist Deposition for Microelectronics

Photoresist Deposition for Microelectronics Photoresist Deposition onto Unconventional Substrates for Microelectronics Manufacturing Spin coating technology faces major limitations when applied to oversized, curved and specially shaped substrates in microelectronic fabrication. As an alternative, ultrasonic spray coating technology is capable of forming highly uniform and conformable photoresist films on the full surface and microstructures of such unconventional substrates. It facilitates high-precision photolithographic processing for [...]

8 07, 2026

Panel Level Packaging

Panel Level Packaging (PLP) Panel-Level Packaging Advanced Photoresist Coating Solutions for Semiconductor Panels With advanced packaging technology shifting from wafer-based processing to oversized panel manufacturing formats, conventional spin coating can no longer deliver even photoresist coverage on expansive rectangular substrates. Ultrasonic spray coating technology delivers an accurate, mass-producible deposition method to form evenly distributed photoresist thin films on panel packaging substrates, applicable to [...]

8 07, 2026

Anti-corrosion Coating

Anti-corrosion Coating Ultrasonic Spray Coating Technology: Applying Thin, Conformal Protective Anti-corrosion Coating In modern industrial manufacturing and materials protection, applying highly effective and reliable anti-corrosion coatings to precision, complex components is a critically important and challenging task. Traditional spraying methods, such as air spraying or brushing, often struggle to achieve uniform coverage on complex geometries, and are prone to issues such as uneven thickness, sagging, or material waste. [...]