Panel Level Packaging
Panel Level Packaging (PLP) Panel-Level Packaging Advanced Photoresist Coating Solutions for Semiconductor Panels With advanced packaging technology shifting from wafer-based processing to oversized panel manufacturing formats, conventional spin coating can no longer deliver even photoresist coverage on expansive rectangular substrates. Ultrasonic spray coating technology delivers an accurate, mass-producible deposition method to form evenly distributed photoresist thin films on panel packaging substrates, applicable to [...]

