Spray Fluxer Today will focus on the latest improvements of ultrasonic spray fluxer design. The new ultrasonic atomizing nozzle is used in both UFM4000L and UFM6000 equipment, and incorporates an air filling system that drives the flux droplets to the PCB to achieve high uniformity and uniformity. The new ultrasonic spray fluxer further improves the design through the following aspects: • Improve equipment maintainability and reduce maintenance costs. [...]

Photoresist Spray Coating The photoresist spray coating system uses ultrasonic nozzle technology. Instead of traditional spin coating equipment, UAM4000L is designed for photoresist coating of wafers with high aspect ratio and deep hole topography (such as MEMS wafers). The system is usually equipped with UAC series or UAL series ultrasonic spray forming nozzles as required. UAM4000L is specially designed for 100, 150, 200 and 300mm wafers, providing automatic [...]

Spray Photoresist Ultrasonic spray photoresist technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than [...]

Spray Coating Photoresist Ultrasonic Spray Coating Photoresist - Ultrasonic Nozzle - Cheersonic Photoresist coatings can be used in the production of electronic devices and microelectromechanical (MEMs) devices. Photoresists are generally polymer materials that are enhanced by exposure to light (ie, by cross-linking negative photoresist materials) or solubilized (positive photoresist materials), so , Light is used to pattern the photoresist coating on the substrate, the technique is called photolithography. [...]