Ultrasonic Spray Coating System For Photoresists Ultrasonic Spray Coating System For Photoresists - Cheersonic The ultrasonic spray coating systems are proven for various applications in which uniform, repeatable coatings of photoresist or polyimide films are required. Based on below application, a. Substrate: flat, square or rectangular; thickness: 1/4’’, b. Size of substrate: width/length: typically 24’’, 30-32"; c. Liquid: photoresists d. Work requirement: 5-10 coatings in a day type [...]

Megasonic Cleaning Technology Megasonic Cleaning Technology - Ultrasonic Cleaning - Cheersonic Megasonic cleaning is developed from ultrasonic cleaning. It uses a transducer to emit megahertz-level high-energy sound waves (vibration generates 0.8 MHz), and the solution molecules are accelerated by this sound wave (the maximum instantaneous speed reaches 30 cm). /s), a cleaning technology that desorbs the adsorbed fine particles by the continuous impact of the high-speed hydrodynamic layer [...]

Introduction of Photoresist Classification Introduction of Photoresist Classification - Deposit Photoresist - Cheersonic 1. Classification by application field Photoresists are classified by application fields and can be divided into PCB photoresists, display panel photoresists, semiconductor photoresists and other photoresists. In the PCB industry: the main photoresists used are dry film photoresist, wet film photoresist, photosensitive solder resist ink, etc. The dry film is pasted on the treated copper-clad [...]

Megasonic Cleaning Systems Megasonic energy is currently a very widely used cleaning method. After adding megasonic energy, the use temperature and process time of the solution can be greatly reduced, and the cleaning effect is more effective. The commonly used frequency of megasonic cleaning is 800kHz-1 MHz, and the megasonic power is 100-600W. Compared with ultrasonic cleaning, the effect of megasonic cleaning is [...]

MSP1000 Batch Type Megasonic Plate Generally, the particle size suitable for megasonic cleaning is 0.1~0.3 μm, and the effect of megasonic cleaning is milder. CONTACT US Batch Type Megasonic Plate We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more. [...]

MSN1000 Sprinkler Megasonic Cleaning Nozzle Generally, the particle size suitable for megasonic cleaning is 0.1~0.3 μm, and the effect of megasonic cleaning is milder. CONTACT US Sprinkler Megasonic Cleaning Nozzle We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more. [...]

MSU1000 Fitted Megasonic Cleaning System Fitted megasonic cleaning system technology not only preserves the advantages of ultrasonic cleaning technology, but also overcomes some of its shortcomings. CONTACT US Fitted Megasonic Cleaning System We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more. [...]

Photoresist Composition Photoresist Composition - Deposition of Thin Photoresist Films - Cheersonic Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. Photoinitiators (including photosensitizers, photoacid generators): Photoinitiators, also known as photosensitizers or photocuring agents, are a type of energy that can absorb a certain wavelength from light (usually ultraviolet light). Photochemical reactions [...]

Semiconductor Packaging Semiconductor Packaging - Semiconductor Coating Systems - Cheersonic A wafer that has been processed through the previous processes results in square chips of equal size (also known as "single wafers"). The next thing to do is to get the individual chips by dicing. Freshly cut chips are fragile and cannot exchange electrical signals, and need to be handled separately. This process is encapsulation, which involves forming [...]

Semiconductor Testing Semiconductor Testing - Semiconductor Coating Systems - Cheersonic The main goal of the test is to check whether the quality of the semiconductor chip reaches a certain standard, thereby eliminating defective products and improving the reliability of the chip. In addition, tested defective products do not enter the packaging step, helping to save cost and time. Electronic Die Sorting (EDS) is one test method for wafers. [...]