Protective Film Coating
Protective Film Coating Ultrasonic coating technology has proven to be a reliable, repeatable, and efficient method for applying a variety of chemical materials to silicon wafer surfaces for wafer and bump protection prior to dicing, grinding, and polishing. Commonly used materials include easy-to-remove chemical coatings such as Z-Coat and PMMA. Our nozzle systems can be customized to meet our customers' specific coating requirements and challenges for dicing [...]

