USP6000WS Automated Ultrasonic Photoresist Coating System
Cheersonic provides wafer-level ultrasonic coating systems that replace traditional spin coating methods in the semiconductor industry—offering unmatched film uniformity, process control, and material efficiency for the photo-lithography process.
Tailored for ultra-precise semiconductor wafer fabrication, the USP6000WS stands as a fully automatic ultrasonic photoresist spraying platform fitted with integrated robotic wafer transport modules.
This equipment adopts Cheersonic’s field-tested ultrasonic atomization coating core alongside a dual-cassette wafer transport framework. It runs the entire wafer processing sequence automatically—including feeding, precision positioning, thin-film deposition and finished wafer discharge—to produce repeatable, exceptionally homogeneous photoresist layers without any manual operation. It natively accommodates 100 mm, 150 mm and 200 mm wafers, while a 300 mm wafer processing kit is offered as an optional upgrade.
Ultrasonic spray offers significant advantages over spin coating or other photoresist deposition methods:
- Capable of forming ultra-even thin film layers, and delivers stable coating effect on deep trenches featuring high aspect ratios that are hard to process via traditional approaches.
- Adopts low-speed atomized spraying mode to guarantee repeatable and stable coating performance.
- The diameter of atomized droplets is adjustable by tuning the operating frequency of the atomizing nozzle.
- The equipment is equipped with a fully automatic XYZ three-axis movement platform supporting program parameter customization.
- Ultrasonic atomizing nozzle assemblies feature outstanding compatibility and can be seamlessly embedded into mass production lines.
PERFECTING YOUR PROCESS
Features
• Uniform heating vacuum wafer holder supporting 100–300mm wafer sizes
• Automated wafer lifting pin set
• Reproducible precision syringe pump with auto liquid refilling
• Two-station rotating spray nozzle unit
• Embedded full-circle bottom air exhaust system to swiftly clear stray coating aerosol
• HEPA-filtered clean air supply inlet
• Automatic nozzle purge and self-cleaning function
• Surround containment ring to collect cleaning solvent and overspray residues
• Onboard liquid level detector for photoresist supply tanks
• Heated Wafer Chuck (with wafer chuck holding): 200mm standard (100, 150 and 300 mm options)
• Dual cassette design: Standard support for 100/150/200 mm wafers; 300 mm wafer compatibility available on request
Basic Specifications
• Flow Rate Range: 1 μl/min – 30 ml/min
• Deposition Repeatability: ± 2%
• Repeatability: 0.025 mm (0.001 in)
• Resolution: 0.015 mm (0.0006 in)
• Photosensitive Lighting: 590nm UV safe lighting
• Single-axis robotic manipulator: Equipped with fast-response brushless motors and zero-backlash transmission for superior positioning accuracy
• Automatic cassette identification & scanning function: Identifies wafer positions and arranges processing queues autonomously
• Cleanroom suitability: Compliant with Class 1 cleanroom environmental standards
• Robotic service life: Mean Time Between Failures (MTBF) exceeds 60,000 operating hours
• Power Requirements: 220-240V AC 50/60Hz, 16A
• Certificate: CE, FDA
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Contact CHEERSONIC For immediate assistance please contact us the corporate headquarters during business hours at 6:00 am – 22:00 pm.
Tel: 0571-87910406
- Mobile: +86 15869049660
- Email: Market2@cheersonic.com
Add: 11-13 Chuangye Road, Changkou, Fuyang, Hangzhou, Zhejiang, China
